Organizer
Alex Yasha Yi, University of Michigan, USA
Co-organizers
Henry Smith, Massachusetts Institute of Technology, USA
Xingjun Wang, Peking University, China
The integration of photonics and electronics has forever transformed the landscape of modern technology. At the forefront of this revolution is the development of Photonic Integrated Circuits (PICs), which are swiftly emerging as the torchbearers of next-gen circuitry. Historically rooted in the traditional 2-D fabrication processes inherited from electronic ICs, PICs have begun a transformative journey toward intricate 3-D configurations.
This symposium seeks to dissect this pivotal transition, offering a comprehensive exploration of both the challenges and opportunities that lie ahead. Beginning with an understanding of the established CMOS fabrication processes and their intersection with single-waveguide-layer PIC configurations, we will illuminate the inherent limitations of this approach and its implications on device performance. The leap from 2-D to 3-D, observed recently in electronic IC designs, isn't just a dimensional shift; it represents a paradigm change in how we conceptualize, design and deploy PICs. But what does this mean for the future of PICs and the broader IC industry? How does the convergence of mature CMOS processes with new 3-D design philosophies impact scalability, efficiency and performance? And as the line between electronic and photonic circuits becomes increasingly blurred, how do we navigate the challenges while harnessing the unparalleled opportunities?
Join us in this symposium as we delve into these pressing questions, offering a roadmap for navigating the complexities of the 3-D PIC landscape and envisioning the next chapter of integrated circuit evolution.
Invited Speakers
Pieter Dumon, Luceda Photonics, Belgium
Colin McDonough, AIM Photonics, USA
Electronic-Photonic Interposers for 3D Integration
Martijn J. R. Heck, Eindhoven University of Technology, Eindhoven Hendrik Casimir Institute, Netherlands
Wafer-scale Heterogeneous Integration for Integrated Photonics
Sean Nelan, University of Delaware, USA
Chao Xiang, University of Hong Kong, Hong Kong
S. J. Ben Yoo, University of California, Davis, USA
3D Electronic Photonic Integrated Circuits (3D EPICs): Co-Design and Co-Integration for Optimal Performance at Scale