• Technical Conference: 

    15 – 20 May 2022

  • Exhibition: 

    17 – 19 May 2022

Micro- and Nanomechanics in Photonic Integrated Circuits


Kristinn Gylfason, Kungliga Tekniska Hogskolan, Sweden


In this topical review we look at the various aspects of integrating micro- and nanomechanical functionality into photonic integrated circuits, for actuation, sensing and optomechanical functions. Photonic integrated circuits have proven their worth in telecommunications and are finding use in emerging applications, such as in the biotechnology and automotive industries. Open-access photonic foundries have democratized the deployment of photonic circuits, but the modest integration level achieved to date is far from its full potential.  Current circuits use only tens to hundreds of active components while scaling to thousands and beyond is needed for versatile large-scale circuits. Also, accurate control of power and phase is needed in all parts of the circuits. A major bottleneck for scaling is the static power consumption of the active components needed for continuous phase and power control.  Current circuits rely mostly on integrated thermo-optic phase shifters and couplers that consume milliwatts to tens of milliwatts each. Thermal crosstalk between such components puts a hard limit on the achievable integration density. In contrast, micro- and nano-electro-mechanical counterparts use less than a microwatt of power for their electrostatic actuators and thus enable continued scaling of photonic integrated circuits. Recent demonstrations of such tuners integrated in commercial photonic foundry platforms has set the scene for a rapid expansion of work in this field.


Invited Speakers

Karen Grutter, The Laboratory for Physical Sciences, USA

NEMS for Cavity Optomechnical Devices

Sangyoon Han,  DGIST, Republic of Korea

Ultra-low Power and Scalable Programmable Silicon Photonic MEMS

Umar Khan,  Ghent University, INTEC, Belgium

Enabling Large Scale Programmable Photonic Integrated Circuits Using MEMS

Wouter Westerveld, Delft University of Technology, Netherlands 

Opto-mechanical Ultrasound Sensors in Silicon Photonics

Ming Wu, University of California Berkeley, USA

Title to be Announced