Organizers
Shinji Matsuo, NTT Corporation, USA
Yasutomo Ota, Keio University, Japan
The introduction of optical interconnections between and within chips is an important approach to overcome the performance bottlenecks imposed by the high power consumption and limited speed of electrical wiring. There are two possible device configurations, either a directly modulated laser or an external modulator. In both cases, it is important to reduce power consumption through miniaturization, and the feasibility of commercial realization is increasing with the progress in nanophotonic technologies. For the case of directly modulated lasers, since the power consumption is proportional to the active volume, the use of highly miniaturized laser resonators that exploit photonic crystal, topological and plasmonic techniques is important, and the progress and the future possibility of these lasers will be discussed. In contrast, nanoscale modulators can be realized using silicon CMOS technology and combined with silicon-photonic light sources via heterogeneous integration techniques. Such a solution would have the great advantage of simultaneously realizing in a single component both large-scale photonic integrated circuits using ultra-compact modulators for optical interconnection and the necessary CMOS electronic circuits for ultra-fast, low energy-consumption data processing. In both cases, the unique characteristics of micro/nanolasers also offer the path to new applications in quantum computing and quantum optics.
Invited Speakers
Daniel Kuchta, IBM TJ Watson Research Center, USA
Progress of High-Speed VCSELs and VCSEL-Based Co-Packaging for Short Reach Communications
Bardia Pezeshki, Avicena Tech Corp, USA
Parallel MicroLED-Based Optical Links with Record Data Rates and Low Power Consumption
Mark Wade, Ayar Labs, USA
Koji Takeda, NTT Device Technology Labs, Japan
Ultra-Short Cavity Membrane Lasers and Photonic Crystal Lasers on Si Photonics Platform
Kresten Yvind, Technical University of Denmark, Denmark
Nanostructured Lasers for Femtojoule Photonics
Markus Scherrer, IBM, Switzerland
Monolithic Integration of Hybrid III-V/Si Photonic Devices
Mercedeh Khajavikhan, University of Southern California, USA
Ryan Hamerly, Massachusetts Institute of Technology, USA
Wavelength Multiplexed Photonic Edge Computing in the Output Stationary Frame