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07 – 12 May 2023
09 – 11 May 2023
San Jose McEnery Convention Center
San Jose, California, USA
Shinji Matsuo, NTT Corporation/Boston University, USA
Yasutomo Ota, Keio University, Japan
The introduction of optical interconnections between and within chips is an important approach to overcome the performance bottlenecks imposed by the high power consumption and limited speed of electrical wiring. There are two possible device configurations, either a directly modulated laser or an external modulator. In both cases, it is important to reduce power consumption through miniaturization, and the feasibility of commercial realization is increasing with the progress in nanophotonic technologies. For the case of directly modulated lasers, since the power consumption is proportional to the active volume, the use of highly miniaturized laser resonators that exploit photonic crystal, topological, and plasmonic techniques is important, and the progress and the future possibility of these lasers will be discussed. In contrast, nanoscale modulators can be realized using silicon CMOS technology and combined with silicon-photonic light sources via heterogeneous integration techniques. Such a solution would have the great advantage of simultaneously realizing in a single component both large-scale photonic integrated circuits using ultra-compact modulators for optical interconnection and the necessary CMOS electronic circuits, for ultra-fast, low energy-consumption data processing. In both cases, the unique characteristics of micro/nanolasers also offer the path to new applications in quantum computing and quantum optics.