• Technical Conference: 

    15 – 20 May 2022

  • Exhibition: 

    17 – 19 May 2022

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Poster

Phononic Integrated Circuitry With an Etchless Fabrication Process (JW1A.182)

Presenter: Ziyao Feng, The Chinese University of Hong Kong

We proposed, theoretically analyzed, and experimentally demonstrated a new type of phononic integrated waveguides, which can be fabricated with an etchless process, for guiding and routing gigahertz mechanical waves on a chip.

Authors:Ziyao Feng, The Chinese University of Hong Kong / Yang Liu, Tsinghua University / Lai Wang, Tsinghua University / Xiankai Sun, The Chinese University of Hong Kong


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