Laser Grooving Technology Study at Dicing Process in GaN Power Devices WLCSP (JW1A.43)
Presenter: Yao-Hsing Liu, National Chiao Tung University
Chipping free is a dream for GaN Epi wafer sawing process. With current high complexity of wafer technology plus the drive for cost reduction by narrowing the saw street width, it is a challenge which requires huge effort for wafer sawing process to achieve chipping free process.
Authors:Yao-Hsing Liu, National Chiao Tung University