• Technical Conference:  5 – 10 May 2019
  • Exhibition: 7 – 9 May 2019

Almost halfway through the Conference, CLEO continues to Impress

By Shamsul Arafin


The third day of CLEO: 2014 started with the Honorary Award Distribution Ceremony which was followed by Plenary Sessions, consisting of two talks. The first one was on Quantum Coherent Networks, presented by Gerhard Rempe from Max-Planck-Institut fur Quantenoptik, Germany. Rempe’s talk initially covered the fundamentals of quantum-coherent networks, an exciting but challenging field of science and technology which allows a new approach to the processing of information for long-distance quantum communication and large-scale quantum simulation applications. He then described how Fabry-Perot cavity quantum electrodynamics with single-atoms trapped in high-finesse optical resonators could be employed for the realization of such quantum networks. The second talk, titled as Photonic Integrated Circuits as Key Enablers for Datacom, Telecom and Sensor Systems, given by Larry A. Coldren from UC-Santa Barbara, USA, addressed that why PICs are desirable for modest to high volume communication, sensing and instrumentation functions, where size, weight, power and cost are of major concerns.

Audience attending CLEO symposium
Audience attending CLEO symposium

 

The special symposium on Laser Processing for Consumer Electronics included an invited talk from Keiji Nomaru, Disco Corporation, Japan that addressed the use of lasers in their semiconductor manufacturing process, such as grinding, cutting and polishing. In his presentation, he discussed the benefits of utilizing ultrafast lasers in the processing and microfabrication of the sapphire wafers with a precise process depth-control and a good cutting-surface quality. Also, Manjusha Mahendale from Rudolph Technologies, USA drew a crowd with her invited talk on Opaque Film Metrology using picosecond ultrasonic laser sonar (PULSE) Technology that is currently being used for the thickness and density evaluation of metal and opaque films as well as for the characterization of multi-layer bumps in advanced packaging applications.

On tap tomorrow, more symposiums and another great plenary.

CLEO: 2014 is being held 8-13 June 2014 in San Jose, CA.

Posted: 11 June 2014 by Shamsul Arafin | with 0 comments

Comments
Blog post currently doesn't have any comments.
 Security code

Sponsored by: