SC198 Packaging of Optoelectronic Components

Tuesday, May 6, 1:30 p.m. - 5:30 p.m.
Andreas Rose; Photonics Res. Corp., USA.

Course Description
Optoelectronic packaging has become increasingly important due to the requirements of high-speed, large-capacity transmissions of information, especially in long-haul and metro-optical networking. Economical, cost-oriented packaging of simple or complex active and passive components is one of the major issues in optical networking. Cost-effective robust optoelectronical packages interfacing solid-state components, functional optical circuitry, and optical fibers are increasingly needed to facilitate deployment of high capacity optical communication systems.

The course will describe the basic principals of optoelectronic packaging of passive and active components, and will guide attendees through modern packaging and related testing procedures. We will emphasize reliability issues, and give an overview of future packaging methods, like "siliconization" of photonics devices.

Benefits and Learning Objectives
This course should enable you to:

• Explain where and why optoelectronic packaging is being deployed.
• Discuss related topics, such as mechanical support, environmental protection, thermal control, electrical connection and optical connection.
• Describe different packaging techniques, e.g, hermetic and non-hermetic sealed packages.
• Identify different coupling schemes by means of fiber to fiber, source to fiber, fiber to detector, fiber to planar waveguide circuit, fiber to linear/nonlinear optical component, free space beam processing, fiber to MEMS devices, etc.
• Evaluate and compare critical issues of different joint techniques, such as adhesive bonding, laser welding and soldering.
• Describe characteristics of package design, mechanical structures and electronic design.
• Discuss issues like cost effectiveness and the reliability of the packaging process, with regard to process integration and automation.
• Discuss future oriented packaging, like integrated optics and siliconization of devices.

Intended Audience
The course is intended for those interested in understanding how modern optoelectronic packaging works, the range of applications and the potential for novel and improved devices. The course is relatively self-contained. It meets the needs of engineers, system designers, scientists, students and managers, especially those who need a picture of state-of-the-art photonic packaging technology and the difficulties in cost effective development and manufacturing.

Instructor Biography
Andreas Rose is General Manager of Photonics Research Corp. He has gained his experience as head of research and development, vice president of engineering, vice president of research and development, and independent contractor in Europe, the U.S. and Japan for several market leaders in laser and fiber optics technology in telecom, datacom, medical, sensor and industrial applications. Andreas is well known as an expert in the scientific and industrial field of fiber optics and lasers.